线路板装配中的无铅工艺应用原则

电子业是否正在实施无铅工艺？

    许多跨国电子公司已经开始启动无铅技术项目，对无铅替代方案进行评估，以做好准备在限制性法律生效后实施无铅系统方案。

    也有许多公司将实施无铅工艺作为一种营销战略，他们希望在营销过程中将其电子产品作为无铅和环保产品进行宣传。

参考文献
1. Manko, Howard H., "Lead Poison, Solder and Safety In the Workplace," ElectronIC PACkaging & Production, February 1994, pp 93-95.
2. Akinade, K., et al, "Lead-Free Solder Pastes Evaluation At Motorola Transmission Products Division," Soldering & Surface Mount Technology, No. 20, May 1995, pp 50-54.
3. Peck, Douglas J., "Solder Materials Survey," Circuits Assembly, April 1995, pp 50-51.
4. Various published and unpublished papers from International Tin Research Institute.
5. Harris, Dr. Paul, "Lead-Free Solders For Electronic Assemblies," International Tin Research Institute Paper.
6. Shangguan, Dongkai, and Achari, Achyuta, "Lead-Free Solder Development For Automotive Electronics Packaging Applications," Proceedings of The Technical Program at Surface Mount International August 1995, pp 423-428.
7. Melton, Cindy, "Nitrogen Atmosphere Processing In Lead-Free Soldering," Proceedings from Nepcon West 1995, pp 1003-1011.
8. Lord, P. C. et al, "Thermal Fatigue Behaviour of Some Lead-Free Solder Alloys," Proceedings from the British Association for Brazing and Soldering Autumn 1996 Conference, October 1996.

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本文关键字：线路板  布线-制版技术，电子学习 - 布线-制版技术